NCP5007
PACKAGE DIMENSIONS
TSOP?5
SN SUFFIX
D
CASE 483?02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
S
5
1
2
4
3
B
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
L
A
G
DIM
A
B
MILLIMETERS INCHES
MIN MAX MIN MAX
2.90 3.10 0.1142 0.1220
1.30 1.70 0.0512 0.0669
C
J
C
D
G
0.90 1.10 0.0354 0.0433
0.25 0.50 0.0098 0.0197
0.85 1.05 0.0335 0.0413
0.05 (0.002)
H
K
M
H
J
K
L
M
0.013 0.100 0.0005 0.0040
0.10 0.26 0.0040 0.0102
0.20 0.60 0.0079 0.0236
1.25 1.55 0.0493 0.0610
0 _
10 _
0 _
10 _
SOLDERING FOOTPRINT*
1.9
S
2.50 3.00 0.0985 0.1181
0.95
0.074
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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21
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NCP5007/D
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